Printed circuit boards (PCBs), often referred to as the “motherboards of electronic products,” are the core platform for electrical interconnection between chips and electronic systems. As AI computing power accelerates, new energy vehicles advance rapidly, and third-generation semiconductors reshape industry boundaries, demand for advanced IC substrates, high-frequency/high-speed PCBs, and high-layer-count boards continues to rise, accelerating the shift toward domestic alternatives.

China’s 15th Five-Year Plan calls for faster development of next-generation intelligent manufacturing, advancing the digital transformation, intelligent upgrading and networked integration of manufacturing, and driving new momentum through “AI + Manufacturing.” In the integrated circuit sector, the Plan also calls for breakthroughs in critical and core technologies across the entire value chain. As a foundational segment of electronic information manufacturing, the PCB industry is entering a strategic window for high-end, digital-intelligent and green transformation.

Hangzhou and the Yangtze River Delta provide a strong industrial base for the Expo. Hangzhou’s Qiantang Chip Valley is home to more than 140 integrated circuit companies, with the industry exceeding RMB 80 billion in scale. Its wafer manufacturing capacity accounts for more than one-quarter of Zhejiang Province’s total, making it the only county-level administrative area in China with wafer manufacturing capabilities spanning 4-inch to 12-inch wafers.

Hangzhou’s “Intelligent Manufacturing Community” Development Action Plan calls for enhanced support for core manufacturing segments across key industrial value chains, including next-generation semiconductors and integrated circuits and embodied intelligent robotics.

The Yangtze River Delta is home to a large concentration of PCB manufacturers, materials and equipment suppliers, supported by well-developed downstream ecosystems in semiconductors, AI computing and new energy. This integrated industrial landscape gives the region a distinctive location advantage and provides a strong foundation for the development of the PCB and intelligent manufacturing industries.

AI computing is rapidly driving PCB demand toward higher layer counts, higher frequencies and higher speeds, shifting the industry’s growth model from scale expansion to technology advancement.

At this critical stage of industrial transformation, Golden Conference & Exhibition Group, together with relevant industry authorities and organizations, will host the 2027 Hangzhou International PCB & Intelligent Manufacturing Equipment Expo from May 27–29, 2027, at the Hangzhou Grand Convention & Exhibition Center. The Expo will be held concurrently and in the same venue as The 2nd Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition (SICE).

Positioned as a core supporting event of the SICE, the PCB Expo will focus on the entire PCB value chain and intelligent manufacturing equipment, addressing a critical link between chips, substrates and hardware manufacturing.

The Expo will work in close synergy with the Changxin Expo’s semiconductor value chain. The main expo will bring together companies across IC design, wafer manufacturing, advanced packaging, Chiplet, third-generation semiconductors and AI chips, many of which are seeking reliable supply chains for IC substrates and high-frequency/high-speed PCBs.

The PCB Expo will facilitate face-to-face business matchmaking between upstream chip companies and PCB/IC substrate manufacturers and intelligent manufacturing equipment suppliers, connecting the full chain from chip design to hardware manufacturing.

Key exhibits will include intelligent manufacturing equipment and solutions for drilling, exposure, electroplating, etching, forming, inspection and testing, automated production lines, MES, industrial internet and AI-powered quality inspection, helping PCB manufacturers reduce costs, improve efficiency and yield, and accelerate digital transformation.

The Expo aims to complete the critical link in the exhibition chain spanning chip design → wafer manufacturing → advanced packaging → IC substrates/PCBs → end-product hardware, while creating a targeted matchmaking platform connecting the PCB and semiconductor industries. It will support advances in the domestic development of high-end IC substrates and intelligent manufacturing equipment, injecting new momentum into the high-quality development of the electronic circuit industry across the Yangtze River Delta and China.

Concurrent Events

The Expo will feature a series of high-level professional events, including the PCB Intelligent Manufacturing & IC Substrate Industry Summit, IC Substrate Technology & Domestic Development Seminar, PCB Intelligent Manufacturing & Digital Transformation Forum, and PCB Green Manufacturing & Sustainable Development Forum. Industry leaders, technology experts and investors will come together to explore emerging trends and opportunities across the sector.

A dedicated PCB/IC Substrate Supply-Demand Matchmaking Session will also be held, bringing together semiconductor companies, downstream manufacturers, research institutes and investment institutions for targeted, face-to-face discussions. The program is designed to facilitate focused technical exchange, accelerate business cooperation and deliver tangible outcomes for exhibitors and participants.

Exhibition Zones

1. Finished PCB Products

Rigid PCBs, flexible PCBs (FPCs), rigid-flex PCBs, high-frequency/high-speed PCBs, heavy-copper PCBs, specialty PCBs, IC substrates (BT/ABF), and more.

2. Key PCB Materials & Chemicals

Copper-clad laminates (CCLs), prepregs, copper foil, inks, dry films, solder masks, plating chemicals, specialty resins, and other key materials and chemicals.

3. Intelligent Manufacturing Process Equipment

Drilling, electroplating, lamination, etching, exposure, forming, laser processing and other PCB manufacturing equipment.

4. Inspection & Testing Equipment

Automated optical inspection (AOI), automated X-ray inspection (AXI), impedance testing, flying probe testing, in-line inspection systems and other testing and inspection solutions.

5. Automated Production Lines & Digital Solutions

Automated production lines, AGV logistics systems, manufacturing execution systems (MES), industrial internet platforms, AI-powered quality control, environmental protection and waste treatment solutions, and more.

6. Business Matchmaking & Industry Services

Closed-door business meetings, investment attraction, talent matchmaking, investment and financing matchmaking, and related industry services.

Target Visitors

The Organizing Committee will conduct targeted outreach to key players across the global electronic information industry, including procurement and R&D professionals from IC design, advanced packaging, Chiplet, third-generation semiconductors, power devices, and AI and memory chip companies.

The outreach will also cover procurement, process R&D and quality management professionals from PCB, FPC and IC substrate manufacturers, copper-clad laminate and material suppliers, and equipment providers; AI server, computing hardware, new energy vehicle electronics, communications, industrial control and consumer electronics manufacturers; and solution providers serving automotive electronics, medical electronics, aerospace and marine electronics.

Other target groups include software ecosystem companies, research institutes, universities, industrial parks, investment institutions, industrial funds, government authorities and industry organizations.

Contact Information

Tel: +86 21 64396190

E-mail: info@goldenexpo.com.cn