AI computing is rapidly driving PCB demand toward higher layer counts, higher frequencies and higher speeds, shifting the industry’s growth model from scale expansion to technology advancement.At this critical stage of industrial transformation, Golden Conference & Exhibition Group, together with relevant industry authorities and organizations, will host the 2027 Hangzhou International PCB & Intelligent Manufacturing Equipment Expo from May 27–29, 2027, at the Hangzhou Grand Convention & Exhibition Center. The Expo will be held concurrently and in the same venue as The 2nd Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition (SICE).Positioned as a core supporting event of the SICE, the PCB Expo will focus on the entire PCB value chain and intelligent manufacturing equipment, addressing a critical link between chips, substrates and hardware manufacturing.